The Pulse Tip Bonding process
The pulse tip design coupled with a unique bonding and control process creates two simultaneous events.
1) Firstly, the special high-temperature bonding tip vaporises the wire insulation.
2) Secondly, under-real-time force and temperature control, the tip is used to produce a thermocompression bond.
This process totally eliminates the need to strip the wire prior to bonding or the need for solder. As a process, it is applicable to a wide range of wire types and substrates and is particularly beneficial on ceramic substrates where troublesome high-temperature solders are generally required.
The process can also be used in conjunction with standard SnPb solder pads.
The energy used for the process is delivered from a precision closed-loop micro controlled power supply which generates a very high, instantaneous pulse of heating energy.
The amount of heat is readily adjustable and precisely controlled from joint to joint.